RRP Electronics Ltd Launched Maharashtra’s First OSAT/ATMP Semiconductor Manufacturing Facility

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Mumbai (Maharashtra) [India] September 19: RRP Electronics Ltd was pleased to announce the launch of Maharashtra’s first OSAT (Outsourced Semiconductor Assembly and Test)/ATMP (Assembly, Testing, Marking, and Packaging) semiconductor manufacturing facility in Navi Mumbai, marking a major milestone in India’s semiconductor mission.

The inauguration was led by Shri Eknath Shinde, Honorable Chief Minister of Maharashtra; Shri Devendra Fadnavis, Deputy Chief Minister; and Shri Ajit Pawar, Deputy Chief Minister of Finance. The event also saw the presence of Shri Uday Samant, Minister of Industries; Dr. Harshdeep Kamble, Principal Secretary of Industries, Government of Maharashtra; Bharat Ratna awardee and renowned cricketer Sachin Tendulkar; and Dr. Anil Kakodkar, Padma Vibhushan awardee and former Chairman of the Department of Atomic Energy.

RRP Electronics Ltd

Supported by a strong technological partnership with HMT Microelectronic AG and its leading associates, this facility was set to redefine the semiconductor landscape. It was equipped to handle advanced packaging technologies such as QFN, BGA, SoC, and mixed ASICs.

In its initial phase, the facility had the capacity to produce 10,000 wafers per month. Future plans included the establishment of a dedicated design house and expansion into LiDAR technology development, addressing the growing demand for automotive power chips, as well as the production of TFT and WATN components for automotive applications.

An MoU was signed between HMT Microelectronic AG and Renowa Vision Inc. The MoU with HMT symbolized projects related to QFN, BGA, ASICs, and later expansion into LiDAR technology. The MoU with Renowa marked a significant leap in RRP’s growth journey, as it allowed the acquisition of technology for OSAT and FAB for NAND memory chips. These are non-volatile storage technologies that do not require power to retain data.

The signing of these MoUs provided RRP with assured revenue generation of over $50 million in the OSAT sector.

This groundbreaking project represented a significant achievement for Maharashtra, further positioning the state as a key player in India’s semiconductor mission.

If you have any objection to this press release content, kindly contact pr.error.rectification@gmail.com to notify us. We will respond and rectify the situation in the next 24 hours.



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RRP Electronics Ltd Launched Maharashtra’s First OSAT/ATMP Semiconductor Manufacturing Facility


Mumbai (Maharashtra) [India] September 19: RRP Electronics Ltd was pleased to announce the launch of Maharashtra’s first OSAT (Outsourced Semiconductor Assembly and Test)/ATMP (Assembly, Testing, Marking, and Packaging) semiconductor manufacturing facility in Navi Mumbai, marking a major milestone in India’s semiconductor mission.

The inauguration was led by Shri Eknath Shinde, Honorable Chief Minister of Maharashtra; Shri Devendra Fadnavis, Deputy Chief Minister; and Shri Ajit Pawar, Deputy Chief Minister of Finance. The event also saw the presence of Shri Uday Samant, Minister of Industries; Dr. Harshdeep Kamble, Principal Secretary of Industries, Government of Maharashtra; Bharat Ratna awardee and renowned cricketer Sachin Tendulkar; and Dr. Anil Kakodkar, Padma Vibhushan awardee and former Chairman of the Department of Atomic Energy.

RRP Electronics Ltd

Supported by a strong technological partnership with HMT Microelectronic AG and its leading associates, this facility was set to redefine the semiconductor landscape. It was equipped to handle advanced packaging technologies such as QFN, BGA, SoC, and mixed ASICs.

In its initial phase, the facility had the capacity to produce 10,000 wafers per month. Future plans included the establishment of a dedicated design house and expansion into LiDAR technology development, addressing the growing demand for automotive power chips, as well as the production of TFT and WATN components for automotive applications.

An MoU was signed between HMT Microelectronic AG and Renowa Vision Inc. The MoU with HMT symbolized projects related to QFN, BGA, ASICs, and later expansion into LiDAR technology. The MoU with Renowa marked a significant leap in RRP’s growth journey, as it allowed the acquisition of technology for OSAT and FAB for NAND memory chips. These are non-volatile storage technologies that do not require power to retain data.

The signing of these MoUs provided RRP with assured revenue generation of over $50 million in the OSAT sector.

This groundbreaking project represented a significant achievement for Maharashtra, further positioning the state as a key player in India’s semiconductor mission.

If you have any objection to this press release content, kindly contact pr.error.rectification@gmail.com to notify us. We will respond and rectify the situation in the next 24 hours.



Source link

Disclaimer

We strive to uphold the highest ethical standards in all of our reporting and coverage. We StartupNews.fyi want to be transparent with our readers about any potential conflicts of interest that may arise in our work. It’s possible that some of the investors we feature may have connections to other businesses, including competitors or companies we write about. However, we want to assure our readers that this will not have any impact on the integrity or impartiality of our reporting. We are committed to delivering accurate, unbiased news and information to our audience, and we will continue to uphold our ethics and principles in all of our work. Thank you for your trust and support.

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