ref=”dofollow” data-ga-onclick=”Inarticle articleshow link click#Tech#href” href=”https://economictimes.indiatimes.com/topic/rrp-electronics” target=”_blank”>RRP Electronics, a ref=”dofollow” data-ga-onclick=”Inarticle articleshow link click#Tech#href” href=”https://economictimes.indiatimes.com/topic/semiconductor-packaging” target=”_blank”>semiconductor packaging company, on Friday said it is building a Rs 24,000 crore fab and a Rs 12,035 crore phase 1 outsourced semiconductor assembly test (OSAT) facility in Maharashtra in partnership with ref=”dofollow” data-ga-onclick=”Inarticle articleshow link click#Tech#href” href=”https://economictimes.indiatimes.com/topic/hmt-zurich” target=”_blank”>HMT Zurich, AMB Taiwan and US-based ref=”dofollow” data-ga-onclick=”Inarticle articleshow link click#Tech#href” href=”https://economictimes.indiatimes.com/topic/deca-technologies” target=”_blank”>Deca Technologies.
A company statement said the initiative is backed by the Maharashtra government. The company is investing in a large-scale technology transfer licence agreement (TTLA) with Deca Technologies, which is also into advanced semiconductor packaging. Decca is backed by ref=”dofollow” data-ga-onclick=”Inarticle articleshow link click#Tech#href” href=”https://economictimes.indiatimes.com/topic/qualcomm” target=”_blank”>Qualcomm,…
