Taiwan Semiconductor Manufacturing Co, the world’s largest contract chipmaker, said on Tuesday it will open a design centre in Munich, Germany, which could at a later date help develop chips via leading manufacturing processes for applications such as artificial intelligence.
President of TSMC Europe, Paul de Bot, said at the company’s 2025 Technology Symposium event that the Munich Design Centre would open during the third quarter of 2025.
“It’s intended to support European customers in designing high-density, high-performance, and energy-efficient…
