As data center-grade processors are getting hotter, companies invent more and more creative ways to cool them down. As Nvidia and its partners are reportedly data-analytics-id=”inline-link” href=”https://www.tomshardware.com/pc-components/liquid-cooling/immersion-cooling-for-data-centers-an-exotic-inevitability” data-before-rewrite-localise=”https://www.tomshardware.com/pc-components/liquid-cooling/immersion-cooling-for-data-centers-an-exotic-inevitability”>experimenting with new cold plates and immersion cooling for next-generation AI GPUs, data-analytics-id=”inline-link” href=”https://www.tomshardware.com/tag/microsoft” data-auto-tag-linker=”true” data-before-rewrite-localise=”https://www.tomshardware.com/tag/microsoft”>Microsoft is proposing to etch microfluidic channels on the back of an actual chip to reduce its peak temperature by up to 65%, making it three times more efficient than cold plates.
Microsoft says it has developed a cooling system that routes fluid directly into…
