Micron teams up with TSMC to deliver HBM4E, targeted for 2027 — collaboration could enable further customization

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Micron has confirmed it will partner with TSMC to manufacture the base logic die for its next-generation HBM4E memory, with production targeted for 2027. The announcement, made during the company’s fiscal Q4 earnings call on September 23, adds yet more detail to an already busy roadmap.

Micron is shipping early HBM4 samples at speeds above 11 Gbps per pin, providing up to 2.8TB/s of bandwidth, and it has already locked down most of its 2026 HBM3E supply agreements. But the big takeaway is that Micron…



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Micron teams up with TSMC to deliver HBM4E, targeted for 2027 — collaboration could enable further customization


Micron has confirmed it will partner with TSMC to manufacture the base logic die for its next-generation HBM4E memory, with production targeted for 2027. The announcement, made during the company’s fiscal Q4 earnings call on September 23, adds yet more detail to an already busy roadmap.

Micron is shipping early HBM4 samples at speeds above 11 Gbps per pin, providing up to 2.8TB/s of bandwidth, and it has already locked down most of its 2026 HBM3E supply agreements. But the big takeaway is that Micron…



Source link

Disclaimer

We strive to uphold the highest ethical standards in all of our reporting and coverage. We StartupNews.fyi want to be transparent with our readers about any potential conflicts of interest that may arise in our work. It’s possible that some of the investors we feature may have connections to other businesses, including competitors or companies we write about. However, we want to assure our readers that this will not have any impact on the integrity or impartiality of our reporting. We are committed to delivering accurate, unbiased news and information to our audience, and we will continue to uphold our ethics and principles in all of our work. Thank you for your trust and support.

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