For the first time, scientists have successfully built a fully functional memory chip using two-dimensional materials and integrated it directly onto a conventional silicon die — a milestone that could change how future semiconductors are made. The research, led by Chunsen Liu and colleagues at Fudan University in Shanghai, was published on October 9 in the journal data-analytics-id=”inline-link” href=”https://go.redirectingat.com/?id=92X1584492&xcust=tomshardware_us_1447272874563110399&xs=1&url=https%3A%2F%2Fwww.nature.com%2Farticles%2Fs41586-025-09621-8&sref=https%3A%2F%2Fwww.tomshardware.com%2Ftech-industry%2Fsemiconductors%2Fresearchers-achieve-breakthrough-integration-of-2d-materials-on-silicon-chips” target=”_blank” data-url=”https://www.nature.com/articles/s41586-025-09621-8″ referrerpolicy=”no-referrer-when-downgrade” rel=”sponsored noopener” data-hl-processed=”skimlinks” data-placeholder-url=”https://go.redirectingat.com/?id=92X1584492&xcust=hawk-custom-tracking&xs=1&url=https%3A%2F%2Fwww.nature.com%2Farticles%2Fs41586-025-09621-8&sref=https%3A%2F%2Fwww.tomshardware.com%2Ftech-industry%2Fsemiconductors%2Fresearchers-achieve-breakthrough-integration-of-2d-materials-on-silicon-chips” data-google-interstitial=”false” data-merchant-name=”nature.com” data-merchant-network=”SkimLinks”>Nature.
The research may mark a turning point for 2D electronics, which have long promised atomic-scale performance and efficiency but…
