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A 1980s-era semiconductor fab in Austin, Texas, is getting a makeover. The Texas Institute for Electronics (TIE), as it’s called now, is tooling up to become the only advanced packaging plant in the world that is dedicated to 3D heterogenous integration (3DHI)—the stacking of chips made of multiple materials, both silicon and non-silicon.
The fab is the infrastructure behind DARPA’s Next-Generation Microelectronics Manufacturing (NGMM) program. “NGMM is focused on a revolution in…
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A 1980s-era semiconductor fab in Austin, Texas, is getting a makeover. The Texas Institute for Electronics (TIE), as it’s called now, is tooling up to become the only advanced packaging plant in the world that is dedicated to 3D heterogenous integration (3DHI)—the stacking of chips made of multiple materials, both silicon and non-silicon.
The fab is the infrastructure behind DARPA’s Next-Generation Microelectronics Manufacturing (NGMM) program. “NGMM is focused on a revolution in…
We strive to uphold the highest ethical standards in all of our reporting and coverage. We StartupNews.fyi want to be transparent with our readers about any potential conflicts of interest that may arise in our work. It’s possible that some of the investors we feature may have connections to other businesses, including competitors or companies we write about. However, we want to assure our readers that this will not have any impact on the integrity or impartiality of our reporting. We are committed to delivering accurate, unbiased news and information to our audience, and we will continue to uphold our ethics and principles in all of our work. Thank you for your trust and support.
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