DARPA invests $1.4 billion to build experimental Texas foundry for next-generation 3D chips — Austin plant to buck standard fab models to focus on high-mix, low-volume production

November 14, 2025

, By Tom’s Hardware

DARPA invests .4 billion to build experimental Texas foundry for next-generation 3D chips — Austin plant to buck standard fab models to focus on high-mix, low-volume production

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In Austin, Texas, a former 1980s chip plant is being refitted into a next-generation research foundry. data-analytics-id=”inline-link” href=”https://www.tomshardware.com/tech-industry/darpa-invests-dollar14-billion-to-build-multi-chiplet-3d-processors-for-military-and-civilian-applications” data-mrf-recirculation=”inline-link” data-before-rewrite-localise=”https://www.tomshardware.com/tech-industry/darpa-invests-dollar14-billion-to-build-multi-chiplet-3d-processors-for-military-and-civilian-applications”>Backed by $1.4 billion from the Department of Defense under DARPA’s Next-Generation Microelectronics Manufacturing (NGMM) program, the facility will concentrate on 3D heterogeneous integration (3DHI), assembling multiple chip types and materials in a single package to push beyond the limits of conventional silicon design.

The ultimate goal of this project is to close the gap between laboratory…

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DARPA invests $1.4 billion to build experimental Texas foundry for next-generation 3D chips — Austin plant to buck standard fab models to focus on high-mix, low-volume production

November 14, 2025

, Published By Tom’s Hardware

DARPA invests .4 billion to build experimental Texas foundry for next-generation 3D chips — Austin plant to buck standard fab models to focus on high-mix, low-volume production

In Austin, Texas, a former 1980s chip plant is being refitted into a next-generation research foundry. data-analytics-id=”inline-link” href=”https://www.tomshardware.com/tech-industry/darpa-invests-dollar14-billion-to-build-multi-chiplet-3d-processors-for-military-and-civilian-applications” data-mrf-recirculation=”inline-link” data-before-rewrite-localise=”https://www.tomshardware.com/tech-industry/darpa-invests-dollar14-billion-to-build-multi-chiplet-3d-processors-for-military-and-civilian-applications”>Backed by $1.4 billion from the Department of Defense under DARPA’s Next-Generation Microelectronics Manufacturing (NGMM) program, the facility will concentrate on 3D heterogeneous integration (3DHI), assembling multiple chip types and materials in a single package to push beyond the limits of conventional silicon design.

The ultimate goal of this project is to close the gap between laboratory…

Disclaimer

We strive to uphold the highest ethical standards in all of our reporting and coverage. We StartupNews.fyi want to be transparent with our readers about any potential conflicts of interest that may arise in our work. It’s possible that some of the investors we feature may have connections to other businesses, including competitors or companies we write about. However, we want to assure our readers that this will not have any impact on the integrity or impartiality of our reporting. We are committed to delivering accurate, unbiased news and information to our audience, and we will continue to uphold our ethics and principles in all of our work. Thank you for your trust and support.

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It’s time: Kogan’s Black Friday sale is here, with up to 70% off in a members-only first look

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