China’s hybrid-bonded AI accelerators could rival Nvidia’s Blackwell GPUs — top semiconductor expert hints at ‘fully controllable domestic solution’

November 28, 2025

, By Tom’s Hardware

China’s hybrid-bonded AI accelerators could rival Nvidia’s Blackwell GPUs — top semiconductor expert hints at ‘fully controllable domestic solution’

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Wei Shaojun, vice chairman of the China Semiconductor Industry Association and professor at Tsinghua University, said at an industry event that AI accelerators consisting of 14nm logic chiplets and 18nm-based DRAMs developed in China could rival Nvidia’s Blackwell processors that are made using a custom 4nm-class process technology at TSMC, reports data-analytics-id=”inline-link” href=”https://www.digitimes.com/news/a20251126PD214/nvidia-3d-ai-chip-4nm-gpgpu.html” target=”_blank” data-url=”https://www.digitimes.com/news/a20251126PD214/nvidia-3d-ai-chip-4nm-gpgpu.html” referrerpolicy=”no-referrer-when-downgrade” data-hl-processed=”none” data-mrf-recirculation=”inline-link”>DigiTimes.

Speaking at the ICC Global CEO Summit, Wei Shaojun indicated that the key to performance efficiency breakthrough would be advanced 3D stacking…

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China’s hybrid-bonded AI accelerators could rival Nvidia’s Blackwell GPUs — top semiconductor expert hints at ‘fully controllable domestic solution’

November 28, 2025

, Published By Tom’s Hardware

China’s hybrid-bonded AI accelerators could rival Nvidia’s Blackwell GPUs — top semiconductor expert hints at ‘fully controllable domestic solution’

Wei Shaojun, vice chairman of the China Semiconductor Industry Association and professor at Tsinghua University, said at an industry event that AI accelerators consisting of 14nm logic chiplets and 18nm-based DRAMs developed in China could rival Nvidia’s Blackwell processors that are made using a custom 4nm-class process technology at TSMC, reports data-analytics-id=”inline-link” href=”https://www.digitimes.com/news/a20251126PD214/nvidia-3d-ai-chip-4nm-gpgpu.html” target=”_blank” data-url=”https://www.digitimes.com/news/a20251126PD214/nvidia-3d-ai-chip-4nm-gpgpu.html” referrerpolicy=”no-referrer-when-downgrade” data-hl-processed=”none” data-mrf-recirculation=”inline-link”>DigiTimes.

Speaking at the ICC Global CEO Summit, Wei Shaojun indicated that the key to performance efficiency breakthrough would be advanced 3D stacking…

Disclaimer

We strive to uphold the highest ethical standards in all of our reporting and coverage. We StartupNews.fyi want to be transparent with our readers about any potential conflicts of interest that may arise in our work. It’s possible that some of the investors we feature may have connections to other businesses, including competitors or companies we write about. However, we want to assure our readers that this will not have any impact on the integrity or impartiality of our reporting. We are committed to delivering accurate, unbiased news and information to our audience, and we will continue to uphold our ethics and principles in all of our work. Thank you for your trust and support.

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