Apple in talks with Indian chipmakers to assemble, package iPhone components: Report

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Apple is in early discussions with Indian chipmakers to assemble and package components for the iPhone, the Economic Times reported on Wednesday, December 17, citing people familiar with the ‌matter.

It ‌is the first time Apple has considered assembling and packaging some chips in India, the ET report ‍said, adding that it is unclear which chips will be packaged at the Sanand facility, though they are likely display chips.

Apple held talks with Murugappa Group-owned CG Semi, which is building an outsourced semiconductor assembly and test (OSAT)…



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Apple in talks with Indian chipmakers to assemble, package iPhone components: Report


Apple is in early discussions with Indian chipmakers to assemble and package components for the iPhone, the Economic Times reported on Wednesday, December 17, citing people familiar with the ‌matter.

It ‌is the first time Apple has considered assembling and packaging some chips in India, the ET report ‍said, adding that it is unclear which chips will be packaged at the Sanand facility, though they are likely display chips.

Apple held talks with Murugappa Group-owned CG Semi, which is building an outsourced semiconductor assembly and test (OSAT)…



Source link

Disclaimer

We strive to uphold the highest ethical standards in all of our reporting and coverage. We StartupNews.fyi want to be transparent with our readers about any potential conflicts of interest that may arise in our work. It’s possible that some of the investors we feature may have connections to other businesses, including competitors or companies we write about. However, we want to assure our readers that this will not have any impact on the integrity or impartiality of our reporting. We are committed to delivering accurate, unbiased news and information to our audience, and we will continue to uphold our ethics and principles in all of our work. Thank you for your trust and support.

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