Shanghai Biren Intelligent Technology Co has data-analytics-id=”inline-link” href=”https://www.scmp.com/business/banking-finance/article/3337272/chinese-ai-chipmaker-biren-kicks-bookbuilding-us624-million-hong-kong-ipo” target=”_blank” data-url=”https://www.scmp.com/business/banking-finance/article/3337272/chinese-ai-chipmaker-biren-kicks-bookbuilding-us624-million-hong-kong-ipo” referrerpolicy=”no-referrer-when-downgrade” data-hl-processed=”none” data-mrf-recirculation=”inline-link”>begun bookbuilding for a Hong Kong initial public offering aimed at raising as much as HK$4.85 billion (US$624 million), as Chinese AI chipmakers accelerate listings to fund expansion amid strong investor demand. The company plans to start trading on January 2, becoming the first new Hong Kong listing of 2026.
According to its exchange filing, Biren is offering approximately 247.7 million shares at a price range of HK$17 to HK$19.60 per share. The company…
