SK hynix to build first U.S. packaging plant for HBM — plugs critical hole in U.S. supply chain, $3.9B investment challenges TSMC and reshapes AI supply chains

December 31, 2025

, By Tom’s Hardware

SK hynix to build first U.S. packaging plant for HBM — plugs critical hole in U.S. supply chain, .9B investment challenges TSMC and reshapes AI supply chains

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SK hynix is bringing its HBM ambitions to U.S. soil with a data-analytics-id=”inline-link” href=”https://www.trendforce.com/news/2025/12/29/news-sk-hynix-reportedly-plans-first-u-s-2-5d-packaging-line-eyes-turnkey-hbm-to-challenge-tsmc/” data-url=”https://www.trendforce.com/news/2025/12/29/news-sk-hynix-reportedly-plans-first-u-s-2-5d-packaging-line-eyes-turnkey-hbm-to-challenge-tsmc/” target=”_blank” referrerpolicy=”no-referrer-when-downgrade” data-hl-processed=”none” data-mrf-recirculation=”inline-link”>$3.9 billion plan to build its first domestic manufacturing facility — a 2.5D advanced packaging plant in West Lafayette, Indiana. The site, developed in partnership with Purdue University, is aimed at producing turnkey HBM modules for AI accelerators by 2028.

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SK hynix to build first U.S. packaging plant for HBM — plugs critical hole in U.S. supply chain, $3.9B investment challenges TSMC and reshapes AI supply chains

December 31, 2025

, Published By Tom’s Hardware

SK hynix to build first U.S. packaging plant for HBM — plugs critical hole in U.S. supply chain, .9B investment challenges TSMC and reshapes AI supply chains

SK hynix is bringing its HBM ambitions to U.S. soil with a data-analytics-id=”inline-link” href=”https://www.trendforce.com/news/2025/12/29/news-sk-hynix-reportedly-plans-first-u-s-2-5d-packaging-line-eyes-turnkey-hbm-to-challenge-tsmc/” data-url=”https://www.trendforce.com/news/2025/12/29/news-sk-hynix-reportedly-plans-first-u-s-2-5d-packaging-line-eyes-turnkey-hbm-to-challenge-tsmc/” target=”_blank” referrerpolicy=”no-referrer-when-downgrade” data-hl-processed=”none” data-mrf-recirculation=”inline-link”>$3.9 billion plan to build its first domestic manufacturing facility — a 2.5D advanced packaging plant in West Lafayette, Indiana. The site, developed in partnership with Purdue University, is aimed at producing turnkey HBM modules for AI accelerators by 2028.

Disclaimer

We strive to uphold the highest ethical standards in all of our reporting and coverage. We StartupNews.fyi want to be transparent with our readers about any potential conflicts of interest that may arise in our work. It’s possible that some of the investors we feature may have connections to other businesses, including competitors or companies we write about. However, we want to assure our readers that this will not have any impact on the integrity or impartiality of our reporting. We are committed to delivering accurate, unbiased news and information to our audience, and we will continue to uphold our ethics and principles in all of our work. Thank you for your trust and support.

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Previous News

Netflix’s newest No. 1 movie is an intense action thriller with Jason Statham — and viewers rate it 90% on Rotten Tomatoes

Next News

Florida Is Building a Highway That Can Wirelessly Charge EVs

Tom’s Hardware

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