Glass wafer materials are emerging as a potential and viable alternative to their more conventional, aged organic counterparts. Replacing plastic-based cores with glass panels, these substrates offer lower warpage and a flatter overall profile, two properties that chipmakers will be keen to take advantage of as packaging becomes more of a performance limiter alongside silicon and memory.
Samsung, AMD, Intel, Broadcom, and even AWS have all been associated with glass-substrate evaluation as they contend…
