Intel Foundry this week released a promotional document aimed at detailing its leading-edge front-end and back-end offerings for AI and HPC applications, and showcased its ‘AI chip test vehicle’ that demonstrates the company’s current packaging capabilities. Indeed, they are quite impressive as the company is showing off an 8 reticle-sized system-in-package (SiP) that features four logic tiles, 12 HBM4-class stacks, and two I/O tiles. More importantly, unlike the massive concept with 16 logic tiles…

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