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Minister of state (MoS) for IT Jitin Prasada said that the first packaged chip is expected to be out by December 2025
India will build chips for the world, aligned across the supply chain, from assembly/testing to design, and manufacturing to exports
The union cabinet cleared four new semiconductor projects with a total investment of INR 4,584 Cr under ISM, about a week ago
Minister of State for Electronics and Information Technology, Jitin Prasada, has reportedly said…
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Minister of state (MoS) for IT Jitin Prasada said that the first packaged chip is expected to be out by December 2025
India will build chips for the world, aligned across the supply chain, from assembly/testing to design, and manufacturing to exports
The union cabinet cleared four new semiconductor projects with a total investment of INR 4,584 Cr under ISM, about a week ago
Minister of State for Electronics and Information Technology, Jitin Prasada, has reportedly said…
We strive to uphold the highest ethical standards in all of our reporting and coverage. We StartupNews.fyi want to be transparent with our readers about any potential conflicts of interest that may arise in our work. It’s possible that some of the investors we feature may have connections to other businesses, including competitors or companies we write about. However, we want to assure our readers that this will not have any impact on the integrity or impartiality of our reporting. We are committed to delivering accurate, unbiased news and information to our audience, and we will continue to uphold our ethics and principles in all of our work. Thank you for your trust and support.
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