Huawei reveals long-range Ascend chip roadmap — three-year plan includes ambitious provision for in-house HBM with up to 1.6 TB/s bandwidth

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Huawei’s AI silicon roadmap is no longer a state secret. Speaking at the Huawei Connect conference on September 18, rotating chairman Xu Zhijun outlined the company’s first official long-range Ascend chip strategy, with four new parts scheduled across the next three years: Ascend 950PR and 950DT in early 2026, followed by Ascend 960 and 970 in 2027 and 2028, respectively.

Huawei says its upcoming 950PR chip will ship in Q1 next year with in-house HBM designed to compete with the likes of SK hynix…



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Huawei reveals long-range Ascend chip roadmap — three-year plan includes ambitious provision for in-house HBM with up to 1.6 TB/s bandwidth



Huawei’s AI silicon roadmap is no longer a state secret. Speaking at the Huawei Connect conference on September 18, rotating chairman Xu Zhijun outlined the company’s first official long-range Ascend chip strategy, with four new parts scheduled across the next three years: Ascend 950PR and 950DT in early 2026, followed by Ascend 960 and 970 in 2027 and 2028, respectively.

Huawei says its upcoming 950PR chip will ship in Q1 next year with in-house HBM designed to compete with the likes of SK hynix…



Source link

Disclaimer

We strive to uphold the highest ethical standards in all of our reporting and coverage. We StartupNews.fyi want to be transparent with our readers about any potential conflicts of interest that may arise in our work. It’s possible that some of the investors we feature may have connections to other businesses, including competitors or companies we write about. However, we want to assure our readers that this will not have any impact on the integrity or impartiality of our reporting. We are committed to delivering accurate, unbiased news and information to our audience, and we will continue to uphold our ethics and principles in all of our work. Thank you for your trust and support.

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