Last week, ASML introduced the Twinscan XT:260 lithography scanner, the industry’s first scanner that has been designed from the ground up for advanced 3D packaging, marking a new era in fab tools.
Advanced packaging technologies like TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) are crucially important to achieve the performance scaling necessary to develop artificial intelligence and to evolve supercomputers.

![[CITYPNG.COM]White Google Play PlayStore Logo – 1500×1500](https://startupnews.fyi/wp-content/uploads/2025/08/CITYPNG.COMWhite-Google-Play-PlayStore-Logo-1500x1500-1-630x630.png)