Industry’s first TSMC COUPE-based optical connectivity solution for next-gen AI chips displayed — Alchip and Ayar Labs show future silicon photonics device

December 1, 2025

, By Tom’s Hardware

Industry’s first TSMC COUPE-based optical connectivity solution for next-gen AI chips displayed — Alchip and Ayar Labs show future silicon photonics device

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At TSMC’s European OIP forum this week, Alchip and Ayar Labs demonstrated a fully integrated, in-package optical I/O engine built on data-analytics-id=”inline-link” href=”https://www.tomshardware.com/desktops/servers/tsmc-details-128-tbps-on-package-communication-solution-an-efficient-silicon-photonics-interconnect-for-ai” data-mrf-recirculation=”inline-link” data-before-rewrite-localise=”https://www.tomshardware.com/desktops/servers/tsmc-details-128-tbps-on-package-communication-solution-an-efficient-silicon-photonics-interconnect-for-ai”>TSMC’s COUPE platform that enables optical connectivity for next-generation AI accelerators. The solution — which combines Ayar’s silicon-photonics TeraPHY IC with Alchip’s electrical interface die and a detachable fiber connector — can deliver up to 100 Tb/s of bandwidth per accelerator and connect to other chips using the industry-standard UCIe interface. The…

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Industry’s first TSMC COUPE-based optical connectivity solution for next-gen AI chips displayed — Alchip and Ayar Labs show future silicon photonics device

December 1, 2025

, Published By Tom’s Hardware

Industry’s first TSMC COUPE-based optical connectivity solution for next-gen AI chips displayed — Alchip and Ayar Labs show future silicon photonics device

At TSMC’s European OIP forum this week, Alchip and Ayar Labs demonstrated a fully integrated, in-package optical I/O engine built on data-analytics-id=”inline-link” href=”https://www.tomshardware.com/desktops/servers/tsmc-details-128-tbps-on-package-communication-solution-an-efficient-silicon-photonics-interconnect-for-ai” data-mrf-recirculation=”inline-link” data-before-rewrite-localise=”https://www.tomshardware.com/desktops/servers/tsmc-details-128-tbps-on-package-communication-solution-an-efficient-silicon-photonics-interconnect-for-ai”>TSMC’s COUPE platform that enables optical connectivity for next-generation AI accelerators. The solution — which combines Ayar’s silicon-photonics TeraPHY IC with Alchip’s electrical interface die and a detachable fiber connector — can deliver up to 100 Tb/s of bandwidth per accelerator and connect to other chips using the industry-standard UCIe interface. The…

Disclaimer

We strive to uphold the highest ethical standards in all of our reporting and coverage. We StartupNews.fyi want to be transparent with our readers about any potential conflicts of interest that may arise in our work. It’s possible that some of the investors we feature may have connections to other businesses, including competitors or companies we write about. However, we want to assure our readers that this will not have any impact on the integrity or impartiality of our reporting. We are committed to delivering accurate, unbiased news and information to our audience, and we will continue to uphold our ethics and principles in all of our work. Thank you for your trust and support.

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