Kioxia’s next-gen 3D NAND production gets expedited to 2026, report claims — high-capacity 332-layer BiCS10 devices to sate growing demand from AI data centers

December 18, 2025

, By Tom’s Hardware

Kioxia’s next-gen 3D NAND production gets expedited to 2026, report claims — high-capacity 332-layer BiCS10 devices to sate growing demand from AI data centers

Share via:

Kioxia will produce its next-generation BICS9 and BICS10 3D NAND memory next year, but will use different fab sites for different types of flash, according to Nikkei. BiCS10 transitions to an all-new 332-layer 3D NAND array to address high-capacity solutions for AI and hyperscalers.

Perhaps the biggest surprise about 332-layer BiCS10 is that Kioxia (and Sandisk) is pulling in production of this type of memory to 2026, if the Nikkei report is correct. The publication states that both companies initially…

Disclaimer

We strive to uphold the highest ethical standards in all of our reporting and coverage. We StartupNews.fyi want to be transparent with our readers about any potential conflicts of interest that may arise in our work. It’s possible that some of the investors we feature may have connections to other businesses, including competitors or companies we write about. However, we want to assure our readers that this will not have any impact on the integrity or impartiality of our reporting. We are committed to delivering accurate, unbiased news and information to our audience, and we will continue to uphold our ethics and principles in all of our work. Thank you for your trust and support.

Previous News

I just watched all 3 Avatar movies in a single day and 2 things surprised me

Next News

Prototype HDMI 2.2 ‘Ultra96’ Cables Will Make Their Debut at CES 2026

Tom’s Hardware

Popular

More Like this

Kioxia’s next-gen 3D NAND production gets expedited to 2026, report claims — high-capacity 332-layer BiCS10 devices to sate growing demand from AI data centers

December 18, 2025

, Published By Tom’s Hardware

Kioxia’s next-gen 3D NAND production gets expedited to 2026, report claims — high-capacity 332-layer BiCS10 devices to sate growing demand from AI data centers

Kioxia will produce its next-generation BICS9 and BICS10 3D NAND memory next year, but will use different fab sites for different types of flash, according to Nikkei. BiCS10 transitions to an all-new 332-layer 3D NAND array to address high-capacity solutions for AI and hyperscalers.

Perhaps the biggest surprise about 332-layer BiCS10 is that Kioxia (and Sandisk) is pulling in production of this type of memory to 2026, if the Nikkei report is correct. The publication states that both companies initially…

Disclaimer

We strive to uphold the highest ethical standards in all of our reporting and coverage. We StartupNews.fyi want to be transparent with our readers about any potential conflicts of interest that may arise in our work. It’s possible that some of the investors we feature may have connections to other businesses, including competitors or companies we write about. However, we want to assure our readers that this will not have any impact on the integrity or impartiality of our reporting. We are committed to delivering accurate, unbiased news and information to our audience, and we will continue to uphold our ethics and principles in all of our work. Thank you for your trust and support.

Website Upgradation is going on for any glitch kindly connect at office@startupnews.fyi

Previous News

I just watched all 3 Avatar movies in a single day and 2 things surprised me

Next News

Prototype HDMI 2.2 ‘Ultra96’ Cables Will Make Their Debut at CES 2026

Tom’s Hardware

More like this

Popular

Block title