Chinese fabs are quietly extending the useful life and performance of older ASML deep ultraviolet lithography systems by upgrading key subsystems, as Beijing pushes to sustain advanced chip output under tightening U.S. and allied export controls, according to the Financial Times. The effort concerns installed immersion DUV tools, particularly ASML’s Twinscan NXT series. It’s understood that these activities have been underway over the past year at several leading-edge Chinese fabs, including those…
