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As AI accelerators and HPC devices grow larger and more complex, advanced chip design continues to move away from the transistor and toward the package. Over the past year, packaging engineers and foundries have converged on the same conclusion — that 2.5D integration is now the primary tech responsible for power delivery, signal integrity at extreme bandwidths, mechanical stability across large areas, and in some cases, even active…
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Tom’s Hardware Premium Roadmaps
As AI accelerators and HPC devices grow larger and more complex, advanced chip design continues to move away from the transistor and toward the package. Over the past year, packaging engineers and foundries have converged on the same conclusion — that 2.5D integration is now the primary tech responsible for power delivery, signal integrity at extreme bandwidths, mechanical stability across large areas, and in some cases, even active…
We strive to uphold the highest ethical standards in all of our reporting and coverage. We StartupNews.fyi want to be transparent with our readers about any potential conflicts of interest that may arise in our work. It’s possible that some of the investors we feature may have connections to other businesses, including competitors or companies we write about. However, we want to assure our readers that this will not have any impact on the integrity or impartiality of our reporting. We are committed to delivering accurate, unbiased news and information to our audience, and we will continue to uphold our ethics and principles in all of our work. Thank you for your trust and support.
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