“As AI workloads surge and package sizes expand, the industry is confronting very real mechanical constraints that impact the trajectory of high-performance computing,” says Deepak Kulkarni, a senior fellow at the chip design company Advanced Micro Devices (AMD). “One of the most fundamental is warpage.”
That’s where glass comes in. It can handle the added heat better than existing substrates, and it will let engineers keep shrinking chip packages—which will make them faster and more…

![[CITYPNG.COM]White Google Play PlayStore Logo – 1500×1500](https://startupnews.fyi/wp-content/uploads/2025/08/CITYPNG.COMWhite-Google-Play-PlayStore-Logo-1500x1500-1-630x630.png)