MediaTek CEO Rick Tsai announces successful development of first 3nm chipset, rumored to be called Dimensity 9400. MediaTek and TSMC working together to optimize efficiency for Dimensity 9400, which lacks low-power cores. AI boom expected to bring positive outcome. Dimensity 9300 currently most powerful smartphone chipset, increasing MediaTek’s market share. Partnership with TSMC allows focus on 3nm chipset, also partnering with Intel for 16nm node. Dimensity 9400 to use TSMC’s N3E process, offering improved yields. Cortex-X5 paired with unnamed CPU design in Dimensity 9400 for improved multi-core performance. MediaTek and Qualcomm expected to introduce more improved silicon in 2024.
Share via:
Disclaimer
We strive to uphold the highest ethical standards in all of our reporting and coverage. We StartupNews.fyi want to be transparent with our readers about any potential conflicts of interest that may arise in our work. It’s possible that some of the investors we feature may have connections to other businesses, including competitors or companies we write about. However, we want to assure our readers that this will not have any impact on the integrity or impartiality of our reporting. We are committed to delivering accurate, unbiased news and information to our audience, and we will continue to uphold our ethics and principles in all of our work. Thank you for your trust and support.
MediaTek CEO talks about partnership with TSMC, first 3nm chip
MediaTek CEO Rick Tsai announces successful development of first 3nm chipset, rumored to be called Dimensity 9400. MediaTek and TSMC working together to optimize efficiency for Dimensity 9400, which lacks low-power cores. AI boom expected to bring positive outcome. Dimensity 9300 currently most powerful smartphone chipset, increasing MediaTek’s market share. Partnership with TSMC allows focus on 3nm chipset, also partnering with Intel for 16nm node. Dimensity 9400 to use TSMC’s N3E process, offering improved yields. Cortex-X5 paired with unnamed CPU design in Dimensity 9400 for improved multi-core performance. MediaTek and Qualcomm expected to introduce more improved silicon in 2024.
Disclaimer
We strive to uphold the highest ethical standards in all of our reporting and coverage. We StartupNews.fyi want to be transparent with our readers about any potential conflicts of interest that may arise in our work. It’s possible that some of the investors we feature may have connections to other businesses, including competitors or companies we write about. However, we want to assure our readers that this will not have any impact on the integrity or impartiality of our reporting. We are committed to delivering accurate, unbiased news and information to our audience, and we will continue to uphold our ethics and principles in all of our work. Thank you for your trust and support.
Website Upgradation is going on for any glitch kindly connect at office@startupnews.fyi
